Details

High-k Gate Dielectrics for CMOS Technology


High-k Gate Dielectrics for CMOS Technology


1. Aufl.

von: Gang He, Zhaoqi Sun

178,99 €

Verlag: Wiley-VCH
Format: PDF
Veröffentl.: 27.06.2012
ISBN/EAN: 9783527646371
Sprache: englisch
Anzahl Seiten: 590

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Beschreibungen

A state-of-the-art overview of high-k dielectric materials for advanced field-effect transistors, from both a fundamental and a technological<br> viewpoint, summarizing the latest research results and development solutions. As such, the book clearly discusses the advantages of these<br> materials over conventional materials and also addresses the issues that accompany their integration into existing production technologies.<br> <br> Aimed at academia and industry alike, this monograph combines introductory parts for newcomers to the field as well as advanced sections<br> with directly applicable solutions for experienced researchers and developers in materials science, physics and electrical engineering.
PREFACE <br> <br> PART ONE: Scaling and Challenge of Si-based CMOS<br> <br> SCALING AND LIMITATION OF SI-BASED CMOS <br> Introduction <br> Scaling and Limitation of CMOS<br> Toward Alternative Gate Stacks Technology<br> Improvements and Alternative to CMOS Technologies <br> Potential Technologies Beyond CMOS <br> Conclusions <br> <br> PART TWO: High-k Deposition and Materials Characterization <br> <br> ISSUES IN HIGH-K GATE DIELECTRICS AND ITS STACK INTERFACES <br> Introduction<br> High-k Dielectrics <br> Metal Gates <br> Integration of High-k Gate Dielectrics with Alternative Channel Materials <br> Summary<br> <br> UV ENGINEERING OF HIGH-K THIN FILMS <br> Introduction <br> Gas Discharge Generation of UV (Excimer) Radiation <br> Excimer Lamp Sources Based on Silent Discharges <br> Predeposition Surface Cleaning for High-k Layers <br> UV Photon Deposition of Ta2O5 Films<br> Photoinduced Deposition of Hf1_xSixOy Layers <br> Summary <br> <br> ATOMIC LAYER DEPOSITION PROCESS OF HF-BASED HIGH-K GATE DIELECTRIC FILM ON SI SUBSTRATE <br> Introduction <br> Precursor Effect on the HfO2 Characteristics <br> Doped and Mixed High-k <br> Summary <br> <br> STRUCTURAL AND ELECTRICAL CHARACTERISTICS OF ALTERNATIVE HIGH-K DIELECTRICS FOR CMOS APPLICATIONS<br> Introduction <br> Requirement of High-k Oxide Materials<br> Rare-Earth Oxide as Alternative Gate Dielectrics <br> Structural Characteristics of High-k RE Oxide Films <br> Electrical Characteristics of High-k RE Oxide Films<br> Conclusions and Perspectives <br> <br> HYGROSCOPIC TOLERANCE AND PERMITTIVITY ENHANCEMENT OF LANTHANUM OXIDE (LA2O3) FOR HIGH-K GATE INSULATORS <br> Introduction <br> Hygroscopic Phenomenon of La2O3 Films <br> Low Permittivity Phenomenon of La2O3 Films <br> Hygroscopic Tolerance Enhancement of La2O3 Films<br> Hygroscopic Tolerance Enhancement of La2O3 Films by Ultraviolet Ozone Treatment <br> Thermodynamic Analysis of Moisture Absorption Phenomenon in High-k Gate Dielectrics <br> Permittivity Enhancement of La2O3 Films by Phase Control <br> Summary <br> <br> CHARACTERIZATION OF HIGH-K DIELECTRIC INTERNAL STRUCTURE BY X-RAY SPECTROSCOPY AND REFLECTOMETRY: NEW APPROACHES TO INTERLAYER IDENTIFICATION AND ANALYSIS <br> Introduction <br> Chemical Bonding and Crystalline Structure of Transition Metal Dielectrics <br> NEXAFS Investigation of Internal Structure <br> Studying the Internal Structure of High-K Dielectric Films by Hard X-Ray Photoelectron Spectroscopy and TEM <br> Studying the Internal Structure of High-K Dielectric Films by X-ray Reflectometry <br> <br> HIGH-K INSULATING FILMS ON SEMICONDUCTORS AND METALS: GENERAL TRENDS IN ELECTRON BAND ALIGNMENT<br> Introduction <br> Band Offsets and IPE Spectroscopy <br> Silicon/Insulator Band Offsets <br> Band Alignment at Interfaces of High-Mobility Semiconductors <br> Metal/Insulator Barriers <br> Conclusions <br> <br> PART THREE: Challenge in Interface Engineering and Electrode <br> <br> INTERFACE ENGINEERING IN THE HIGH-K DIELECTRIC GATE STACKS <br> Introduction <br> High-k Oxide/Si Interfaces<br> Metal Gate/High-k Dielectric Interfaces <br> Chemical Tuning of Band Alignments for Metal Gate/High-k Oxide Interfaces <br> Summary and Discussion <br> <br> INTERFACIAL DIPOLE EFFECTS ON HIGH-K GATE STACKS <br> Introduction <br> Metal Gate Consideration <br> Interfacial Dipole Effects in High-k Gate Stacks <br> Observation of the Interfacial Dipole in High-k Stacks <br> Summary <br> <br> METAL GATE ELECTRODE FOR ADVANCED CMOS APPLICATION <br> The Scaling and Improved Performance of MOSFET Devices <br> Urgent Issues about MOS Gate Materials for Sub-0.1 mm Device Gate Stack <br> New Requirements of MOS Gate Materials for Sub-0.1 mm Device Gate Stack <br> Summary<br> <br> PART FOUR: Development in non-Si-based CMOS technology <br> <br> METAL GATE/HIGH-K CMOS EVOLUTION FROM SI TO GE PLATFORM<br> Introduction<br> High-k/Si CMOSFETs <br> High-k/Ge CMOSFETs <br> Ge Platform<br> Conclusions <br> <br> THEORETICAL PROGRESS ONGAAS (001)SURFACE ANDGAAS/HIGH-K INTERFACE <br> Introduction<br> Computational Method<br> GaAs Surface Oxidation and Passivation <br> Origin of Gap States at the High-k/GaAs Interface and Interface Passivation <br> Conclusions<br> <br> III -<br> V MOSFETS WITH ALD HIGH-K GATE DIELECTRICS<br> Introduction<br> Buried Channel InGaAs MOSFETs <br> Summary <br> <br> PART FIVE: High-k Application in Novel Devices <br> <br> HIGH-K DIELECTRICS IN FERROELECTRIC GATE FIELD EFFECT TRANSISTORS FOR NONVOLATILE MEMORY APPLICATIONS <br> Introduction <br> Overview of High-k Dielectric Studies for FeFET Applications <br> Developing of HfTaO Buffer Layers for FeFET Applications <br> Summary <br> <br> RARE-EARTH OXIDES AS HIGH-K GATE DIELECTRICS FOR ADVANCED DEVICE ARCHITECTURES <br> Introduction <br> Key Challenges for High-k Dielectrics <br> Rare-Earth Oxides as High-k Dielectrics <br> High-k Dielectrics in Advanced Device Architecture <br> <br> PART SIX: Challenge and Future Directions <br> <br> THE INTERACTION CHALLENGES WITH NOVEL MATERIALS IN DEVELOPING HIGH-PERFORMANCE AND LOW-LEAKAGE HIGH-K/METAL GATE CMOS TRANSISTORS <br> Introduction <br> Traditional CMOS Integration Processes <br> High-k/Metal Gate Integration Processes<br> Mobility <br> Metal Electrodes and Effective Work Function <br> Tinv Scaling and Impacts on Gate Leakage and Effective Work Function <br> Ambients and Oxygen Vacancy-Induced Modulation of Threshold Voltage <br> Reliability<br> Conclusions <br>
<b>Gang He </b>is Professor at the School of Physics and Materials Science of the Anhui University, China. He obtained his academic degrees from the Institute of Solid State Physics of the Chinese Academy of Sciences. His research interests and efforts cover the areas of the preparation, characterization, fundamental understanding and associated applications of high-k gate dielectric thin films. Due to his outstanding performance in research work, he won a scholarship award from the Chinese Academy of Sciences in 2005 and a grant of the Japanese Society for the Promotion of Science in 2006.<br /> <br /> <b>Zhaoqi Sun</b> is the President of the School of Physics and Materials Science at the Anhui University. He graduated from Sichuan University and obtained his academic degrees from the University of Science and Technology of China. His research is focused on functional thin film materials for applications in microelectronics. Zhaoqi Sun has authored more than 140 scientific publications and has received numerous scientific awards, including the Science and Technology Award of the Anhui Province and an Outstanding Teacher Award.
A state-of-the-art overview of high-k dielectric materials for advanced field-effect transistors, from both a fundamental and a technological<br> viewpoint, summarizing the latest research results and development solutions. As such, the book clearly discusses the advantages of these<br> materials over conventional materials and also addresses the issues that accompany their integration into existing production technologies.<br> <br> Aimed at academia and industry alike, this monograph combines introductory parts for newcomers to the field as well as advanced sections<br> with directly applicable solutions for experienced researchers and developers in materials science, physics and electrical engineering.

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