Details

From LED to Solid State Lighting


From LED to Solid State Lighting

Principles, Materials, Packaging, Characterization, and Applications
1. Aufl.

von: S. W. Ricky Lee, Jeffery C. C. Lo, Mian Tao, Huaiyu Ye

101,99 €

Verlag: Wiley
Format: EPUB
Veröffentl.: 17.09.2021
ISBN/EAN: 9781118881552
Sprache: englisch
Anzahl Seiten: 256

DRM-geschütztes eBook, Sie benötigen z.B. Adobe Digital Editions und eine Adobe ID zum Lesen.

Beschreibungen

<i><b>A comprehensive reference including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field</b></i><br /><br />• An introductory/intermediate level treatment including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field<br />• The authors lead a LED packaging R&D center with an industrial grade prototyping line and state-of-the-art facilities for materials/optical/electrical/thermal characterization. A substantial amount of technical contents in this book is based on the hands-on experience and experimental practices of the authors<br />• The manufacture of LED-based luminaries for lighting is a huge area and there is a need for a comprehensive book instructing engineers and designers in the lighting industry<br />• Includes packaging LED components such as interconnection, phosphor deposition, encapsulation, thermal management and reliability, making this an excellent reference and background reading for engineers and researchers
<p>Preface ix</p> <p>About the Authors xi</p> <p>1 LED for Solid-State Lighting 1</p> <p>1.1 Introduction 1</p> <p>1.2 Evolution of Light Sources and Lighting Systems 2</p> <p>1.3 Historical Development of LED 4</p> <p>1.4 Implementation of White Light Illumination with LED 6</p> <p>1.5 LED for General Lighting 8</p> <p>References 9</p> <p>2 Packaging of LED Chips 11</p> <p>2.1 Introduction 11</p> <p>2.2 Overall Packaging Process and LED Package Types 12</p> <p>2.2.1 PTH LED Component 13</p> <p>2.2.2 SMD LED Component 14</p> <p>2.3 Chip Mounting and Interconnection 16</p> <p>2.3.1 Die Attach Adhesive 17</p> <p>2.3.2 Soldering and Eutectic Bonding 21</p> <p>2.3.3 Wire Bonding 26</p> <p>2.3.4 Flip Chip 29</p> <p>2.4 Phosphor Coating and Dispensing Process 33</p> <p>2.4.1 Dispersed Dispensing 34</p> <p>2.4.2 Conformal Coating 37</p> <p>2.4.3 Remote Phosphor 41</p> <p>2.5 Encapsulation and Molding Process 43</p> <p>2.5.1 Encapsulant Filling with Lens 43</p> <p>2.5.2 Lens Molding 44</p> <p>2.6 Secondary Optics and Lens Design 45</p> <p>References 48</p> <p>3 Chip Scale and Wafer Level Packaging of LED 53</p> <p>3.1 Introduction 53</p> <p>3.2 Chip Scale Packaging 55</p> <p>3.3 Enabling Technologies for Wafer Level Packaging 58</p> <p>3.3.1 Photolithography 58</p> <p>3.3.2 Wafer Etching 61</p> <p>3.3.3 TSV Filling 64</p> <p>3.3.4 Bond Pad Metallization 66</p> <p>3.3.5 Wafer Level Phosphor Deposition Methods 68</p> <p>3.3.6 Moldless Encapsulation 78</p> <p>3.4 Designs and Structures of LED Wafer Level Packaging 82</p> <p>3.5 Processes of LED Wafer Level Packaging 86</p> <p>References 96</p> <p>4 Board Level Assemblies and LED Modules 99</p> <p>4.1 Introduction 99</p> <p>4.2 Board Level Assembly Processes 100</p> <p>4.2.1 Metal Core Printed Circuit Board 100</p> <p>4.2.2 Printed Circuit Board with Thermal Vias 107</p> <p>4.2.3 Wave Soldering 112</p> <p>4.2.4 Surface Mount Reflow 114</p> <p>4.3 Chip on Board Assemblies 118</p> <p>4.4 LED Modules and Considerations 124</p> <p>References 127</p> <p>5 Optical, Electrical, and Thermal Performance 131</p> <p>5.1 Evaluation of Optical Performance 131</p> <p>5.1.1 Basic Concepts about Radiometric and Photometric 131</p> <p>5.1.2 Irradiance Measurement Calibration 140</p> <p>5.1.3 Common Measurement Equipment 141</p> <p>5.2 Power Supply and Efficiency 144</p> <p>5.2.1 Electrical characteristic of LED 145</p> <p>5.2.2 Power supply for LED 146</p> <p>5.2.3 Power efficiency 147</p> <p>5.3 Consideration of LED Thermal Performance 148</p> <p>5.3.1 Thermal characterization methods for LED 148</p> <p>5.3.2 Thermal management methods 155</p> <p>Reference 156</p> <p>6 Reliability Engineering for LED Packaging 159</p> <p>6.1 Concept of Reliability and Test Methods 160</p> <p>6.1.1 Reliability of electronic components or system 160</p> <p>6.1.2 Common failure mechanisms and reliability tests 161</p> <p>6.2 Failure Analysis and Life Assessment 165</p> <p>6.2.1 Methodology for failure analysis 165</p> <p>6.2.2 Weibull analysis and acceleration model for life assessment 166</p> <p>6.3 Design for Reliability 169</p> <p>References 171</p> <p>7 Emerging Applications of LED 173</p> <p>7.1 LED for Automotive Lighting 173</p> <p>7.1.1 Development 173</p> <p>7.1.2 Typical structures 174</p> <p>7.1.3 Challenges 175</p> <p>7.1.4 Conclusion 178</p> <p>7.2 Micro and Mini LED Display 178</p> <p>7.2.1 Development 179</p> <p>7.2.2 Typical structures 184</p> <p>7.2.3 Challenges 186</p> <p>7.2.4 Conclusion 186</p> <p>7.3 LED for Visible Light Communications 187</p> <p>7.3.1 Development 188</p> <p>7.3.2 Typical applications 189</p> <p>7.3.3 Challenges 190</p> <p>7.3.4 Conclusion 191</p> <p>References 192</p> <p>8 LED beyond Visible Light 197</p> <p>8.1 Applications of UV LED 197</p> <p>8.1.1 Structures 198</p> <p>8.1.2 Applications 201</p> <p>8.1.3. Challenges 204</p> <p>8.1.4 Conclusion 208</p> <p>8.2 Applications of IR-LED 208</p> <p>8.2.1 Structures 209</p> <p>8.2.2 Applications 210</p> <p>8.2.3 Challenges 214</p> <p>8.2.4 Conclusion 215</p> <p>8.3 Future Outlook and Other Technology Trends 216</p> <p>8.3.1 Better light source 216</p> <p>8.3.2 Interconnection 217</p> <p>8.3.3 Interaction with human 218</p> <p>8.3.4 Light on demand 219</p> <p>References 219</p>

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