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<p><i>Preface ix</i></p> <p><i>Contributors xi</i></p> <p><b>PART I INTRODUCTION 1</b></p> <p>1 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES 3<br /> <i>Mrityunjay Singh, Tatsuki Ohji, Rajiv Asthana, and Sanjay Mathur</i></p> <p><b>PART II SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION 15</b></p> <p>2 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES 17<br /> <i>Jolanta Janczak-Rusch</i></p> <p>3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY 39<br /> <i>Monica Ferraris, Milena Salvo, and Valentina Casalegno</i></p> <p>4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC AND CERAMIC–METAL JOINING 91<br /> <i>K. S. Weil, J. T. Darsell, and J. Y. Kim</i></p> <p>5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS 143<br /> <i>Michael C. Halbig and Mrityunjay Singh</i></p> <p>6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS 163<br /> <i>Mrityunjay Singh and Rajiv Asthana</i></p> <p>7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOINING AND INTEGRATION 193<br /> <i>V. M. Perevertailo and O. B. Loginova</i></p> <p><b>PART III INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION 231</b></p> <p>8 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS 233<br /> <i>Richard Matz</i></p> <p>9 OXIDE THERMOELECTRIC POWER GENERATION 267<br /> <i>Ryoji Funahashi, Saori Urata, Atsuko Kosuga, and Delphine Flahaut</i></p> <p>10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS 297<br /> <i>Yoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, Koichi Hamamoto, Masanobu Awano, and Nigel Sammes</i></p> <p>11 INTEGRATION TECHNOLOGIES FOR SENSORS 323<br /> <i>Woosuck Shin, Maiko Nishibori, and Ichiro Matsubara</i></p> <p>12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS 339<br /> <i>Talha Erdem and Hilmi Volkan Demir</i></p> <p>13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION 393<br /> <i>Takashi Goto</i></p> <p>14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY 415<br /> <i>Cher Ming Tan and Yuejin Hou</i></p> <p>15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FOR TUNABLE MICROWAVE APPLICATIONS 449<br /> <i>Ashok Kumar, Supriya Ketkar, and Venkataraman Gurumurthy</i></p> <p>16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES 489<br /> <i>Jun Akedo</i></p> <p><b>PART IV NANO- AND BIOINTEGRATION 521</b></p> <p>17 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY 523<br /> <i>Yoshitake Masuda and Kunihito Koumoto</i></p> <p>18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES 575<br /> <i>F. Hernández-Ramírez, J. D. Prades, A. Romano-Rodriguez, S. Barth, H. Shen, and S. Mathur</i></p> <p>19 INTEGRATING DIAMOND-LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS) 641<br /> <i>Xijun Li and Daniel H. C. Chua</i></p> <p>20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES 671<br /> <i>D. Pliszka, S. Sundarrajan, and S. Ramakrishna</i></p> <p>21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY 699<br /> <i>C. Jin, W. Wei, R. Aggarwal, and R. J. Narayan</i></p> <p>22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS 721<br /> <i>Ataur Sarkar and M. Saif Islam</i></p> <p>23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS 743<br /> <i>Umur Caglar, Ville Pekkanen, Jani Valkama, Pauliina Mansikkamäki, and Jussi Pekkanen</i></p> <p>24 BIOINTEGRATION OF PROSTHETIC DEVICES 777<br /> <i>Masakazu Kawashita, Toshiki Miyazaki, and Chikara Ohtsuki</i></p> <p><i>Index 803</i></p>

<p>Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientist at Ohio Aerospace Institute, NASA Glenn Research Center, and is actively involved in various activities related to processing, manufacturing, joining and attachment technologies. He is Academician of World Academy of Ceramics and Governor of Acta Materialia, Inc. He has authored or coauthored more than two hundred thirty publications, edited forty two books/journal volumes, and holds several patents and technology transfers to industries. He is recipient of numerous (more than forty) national and international awards from all over the world including four R&D 100 awards, NASA Public Service Medal, and NASA Exceptional Space Act Award for outstanding and extraordinary contributions to various NASA programs.</p> <p>Tatsuki Ohji, PhD, FACerS, is the Prime Senior Research Scientist at Japan's National Institute of Advanced Industrial Science and Technology (AIST). His research interests include characterization of ceramics, ceramic composites and porous materials, design of advanced ceramics, and green ceramic manufacturing. He has authored or coauthored more than 320 scientific papers and nine books, and holds more than forty patents. He is a fellow of the American Ceramic Society, Academician of the World Academy of Ceramics, a Governor of Acta Materialia, Inc., and editorial board member of many international journals.</p> <p>Rajiv Asthana, PhD, FASM, is a professor at the University of Wisconsin-Stout where he teaches in the manufacturing engineering and engineering technology programs. His research interests include ceramic/metal joining, high-temperature capillarity and cast metal-matrix composites. He is the author or coauthor of four books and 150 refereed papers, an Associate Editor of Journal of Materials Engineering & Performance, guest editor and editorial board member of several refereed journals, and a fellow of ASM International.</p> <p>Sanjay Mathur, PhD, is professor at the Institute of Inorganic Chemistry at the University of Cologne, Germany. The major research thrust of his group include chemical synthesis of functional nanostructures and their processing for product and device applications. He was an Alexander von Humboldt Fellow at the Saarland University, where he accomplished his Habilitation. He has authored or coauthored over 150 publications, edited a book, holds several patents, and is and Associate Editor of International Journal of Applied Ceramic Technology and Nanomaterials.</p>

<p>The ultimate resource on the state-of-the-art science involved in integration at multiple lengths scales, from the very large to the very small</p> <p>The collective knowledge presented in the twenty-four chapters of this volume captures the diversity and unity of joining and integration methodologies across disciplines and length scales, focusing mainly on the integration of ceramics and ceramic-based materials in various sectors of technology. This book addresses joining and integration issues at the macro-, micro- and nano-scales in diverse areas such as aerospace, nuclear, thermoelectric power, micro-electro-mechanical systems, solid oxide fuel cells, multi-chip modules, and prosthetic devices to promote integration as a key enabler of advanced technology. The key features in Ceramic Integration and Joining Technologies include:</p> <ul> <li> <p>Chapter contributions from acknowledged experts representing industry, government, and academia</p> </li> <li> <p>Coverage of state-of-the-art science and engineering design data, facts, cases, and industrial and research insights, balancing engineering and scientific information to cater to the needs of the practitioner and researcher alike</p> </li> <li> <p>Exploration of the most critical issues involved in integration at multiple lengths scales, from the very large to the very small</p> </li> </ul> <p>As more educational and research institutions begin to incorporate knowledge about integration into their professional studies, the in-depth, cutting-edge treatment of selected areas discussed in this book will prove to be invaluable for students and practitioners interested in enhancing their studies in this cutting-edge field.</p>

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