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<p><i>Preface ix</i></p> <p><i>Introduction xi</i></p> <p><b>Creation of Surface Geometric Structures by Thermal Micro-Lines Patterning Techniques 1</b><br /><i>Soshu Kirihara, Satoko Tasaki, and Yusuke Itakura</i></p> <p><b>Magnetoelectric Properties of La-Modified BiFe03 Thin Films on Strontium Ruthenate (SrRu03) Buffered Layer 9</b><br /><i>Regina C. Deus, Cesar R. Foschini, Jose A. Varela, Elson Longo, and Alexandre Z. Simoes</i></p> <p><b>Properties of Pb(Zr,Ti)03/CoFe204/Pb(Zr,Ti)03 Layered Thin Films Prepared Via Chemical Solution Deposition 23</b><br /><i>Yoshikatsu Kawabata, Makoto Moriya, Wataru Sakamoto, and Toshinobu Yogo</i></p> <p><b>Intelligent Processes Enable New Products in the Field of Non-Oxide Ceramics 31</b><br /><i>Jens Eichler</i></p> <p><b>Fabricating Successful Ceramic Components using Development Carrier Systems 37</b><br /><i>Tom Standring, Bhupa Prajapati, Alex Cendrowicz, Paul Wilson, and Stuart Blackburn</i></p> <p><b>Optimized Shaping Process for Transparent Spinel Ceramic 49</b><br /><i>Alfred Kaiser, Thomas Hutzler, Andreas Krell, and Robert Kremer</i></p> <p><b>Combustion Synthesis (SHS) of Complex Ceramic Materials 57</b><br /><i>Jerzy Lis</i></p> <p><b>Wear and Reactivity Studies of Melt Infiltrated Ceramic Matrix Composite 69</b><br /><i>D. C. Jarmon and G. C. Ojard</i></p> <p><b>Fabrication and Properties of High Thermal Conductivity Silicon Nitride 79</b><br /><i>You Zhou, Hideki Hyuga, Tatsuki Ohji, and Kiyoshi Hirao</i></p> <p><b>Porous Silicon Carbide Derived from Polymer Blend 89</b><br /><i>Ken'ichiro Kita and Naoki Kondo</i></p> <p><b>Processing and Properties of Zirconia Toughened WC-Based Cermets 97</b><br /><i>I. Hussainova, N. Voltsihhin, M. E. Cura, and S-P. Hannula</i></p> <p><b>Mechanism of the Carbothermal Synthesis of MgAI204-SiC Refractory Composite Powders by Forsterite, Alumina and Carbon Black 105</b><br /><i>Hongxi Zhu, Hongjuan Duan, Wenjie Yuan, and Chengji Deng</i></p> <p><b>Joining of Alumina by Polycarbosilane and Siloxane Including Phenyl Groups 111</b><br /><i>Ken'ichiro Kita and Naoki Kondo</i></p> <p><b>Microwave Joining of Alumina using a Liquid Phase Sintered Alumina Insert* 123</b><br /><i>Naoki Kondo, Mikinori Hotta, Hideki Hyuga, Kiyoshi Hirao, and Hideki Kita</i></p> <p><b>Joining of Silicon Nitride Long Pipes without Insert Material by Local Heating Technique 129</b><br /><i>Mikinori Hotta, Naoki Kondo, Hideki Kita, and Tatsuki Ohji</i></p> <p><b>Interfacial Characterization of Diffusion-Bonded Monolithic and Fiber-Bonded Silicon Carbide Ceramics 133</b><br /><i>H. Tsuda, S. Mori, M. C. Halbig, and M. Singh</i></p> <p><b>Round Robin on Indentation Fracture Resistance of Silicon Carbide for Small Ceramic Products 143</b><br /><i>Hiroyuki Miyazaki, Yu-ichi Yoshizawa, and Kouichi Yasuda</i></p> <p><b>Numerical Analysis of Microstructural Fracture Behavior in Nano Composites under HVEM 151</b><br /><i>Hisashi Serizawa, Tamaki Shibayama, and Hidekazu Murakawa</i></p>

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