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<b>PREFACE.</b> <p><b>PART I INDIVIDUAL <i>RF</i> BLOCKS.</b></p> <p><b>1. <i>LNA</i> (LOW NOISE AMPLIFIER).</b></p> <p>1.1 Introduction.</p> <p>1.2 Single-Ended Single Device <i>LN</i>A.</p> <p>1.3 Single-Ended Cascode <i>LNA</i>.</p> <p>1.4 <i>LNA</i> with <i>AG</i>C (Automatic Gain Control).</p> <p><b>2. MIXERS.</b></p> <p>2.1 Introduction.</p> <p>2.2 Passive Mixers.</p> <p>2.3 Active Mixers.</p> <p>2.4 Design Schemes.</p> <p><b>3. DIFFERENTIAL PAIRS.</b></p> <p>3.1 Why Differential Pairs?</p> <p>3.2 Can <i>DC</i> Offset be Blocked by a Capacitor?</p> <p>3.3 Fundamentals of Differential Pairs.</p> <p>3.4 <i>CMRR</i> (Common Mode Rejection Ratio).</p> <p><b>4. <i>RF</i> BALUN.</b></p> <p>4.1 Introduction.</p> <p>4.2 Transformer Baluns.</p> <p>4.3 <i>LC</i> Baluns.</p> <p>4.4 Micro Strip Line Baluns.</p> <p>4.5 Mixed Types of Baluns.</p> <p><b>5. TUNABLE FILTERS.</b></p> <p>5.1 Tunable Filters in Communication Systems.</p> <p>5.2 Coupling Between Two Tank Circuits.</p> <p>5.3 Circuit Description.</p> <p>5.4 Effect of Second Coupling.</p> <p>5.5 Performance.</p> <p><b>6. <i>VCO</i> (VOLTAGE-CONTROLLED OSCILLATOR)</b></p> <p>6.1 “Three-Point” Type Oscillators.</p> <p>6.2 Other Single-Ended Oscillators.</p> <p>6.3 <i>VCO</i> and <i>PLL.</i></p> <p>6.4 Design Example of a Single-Ended <i>VCO.</i></p> <p>6.5 Differential <i>VCO</i> and Quad Phases <i>VCO.</i></p> <p><b>7. POWER AMPLIFIERS (<i>PA</i>).</b></p> <p>7.1 Classifications of Power Amplifiers.</p> <p>7.2 Single-Ended <i>PA</i> Design.</p> <p>7.3 Single-Ended <i>PA-IC</i> Design.</p> <p>7.4 Push-Pull <i>PA</i> Design.</p> <p>7.5 <i>PA</i> with Temperature Compensation.</p> <p>7.6 <i>PA</i> with Output Power Control.</p> <p>7.7 Linear <i>PA.</i></p> <p><b>PART II DESIGN TECHNOLOGIES AND SCHEMES</b>.<br /> </p> <p><b>8. DIFFERENT METHODOLOGY BETWEEN <i>RF</i> AND DIGITAL CIRCUIT DESIGN.</b></p> <p>8.1 Controversy.</p> <p>8.2 Differences between <i>RF</i> and Digital Blocks in a Communication System.</p> <p>8.3 Conclusion.</p> <p>8.4 Notes for High-Speed Digital Circuit Design.</p> <p><b>9. VOLTAGE AND POWER TRANSPORTATION.</b></p> <p>9.1 Voltage Delivered from a Source to a Load.</p> <p>9.2 Power Delivered from a Source to a Load.</p> <p>9.3 Impedance Conjugate Matching.</p> <p>9.4 Additional Effects of Impedance Matching.</p> <p><b>10. IMPEDANCE MATCHING IN NARROW-BAND CASE.</b></p> <p>10.1 Introduction.</p> <p>10.2 Impedance Matching by Means of Return Loss Adjustment.</p> <p>10.3 Impedance Matching Network Built of One Part.</p> <p>10.4 Impedance Matching Network Built of Two Parts.</p> <p>10.5 Impedance Matching Network Built of Three Parts.</p> <p>10.6 Impedance Matching When <i>ZS</i> or <i>ZL</i> Is Not 50 <i>Ω.</i></p> <p>10.7 Parts in an Impedance Matching Network.</p> <p><b>11. IMPEDANCE MATCHING IN A WIDE-BAND CASE.</b></p> <p>11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart.</p> <p>11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch.</p> <p>11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch.</p> <p>11.4 Impedance Matching in <i>IQ</i> Modulator Design for a <i>UWB</i> System.</p> <p>11.5 Discussion of Wide-band Impedance Matching Networks.</p> <p><b>12. IMPEDANCE AND GAIN OF A RAW DEVICE.</b></p> <p>12.1 Introduction.</p> <p>12.2 Miller Effect.</p> <p>12.3 Small Signal Model of a Bipolar Transistor.</p> <p>12.4 Bipolar Transistor with <i>CE</i> (Common Emitter) Configuration.</p> <p>12.5 Bipolar Transistor with <i>CB</i> (Common Base) Configuration.</p> <p>12.6 Bipolar Transistor with <i>CC</i> (Common Collector) Configuration..</p> <p>12.7 Small Signal Model of a <i>MOSFET</i> Transistor</p> <p>12.8 Similarity between Bipolar and <i>MOSFET</i> Transistors.</p> <p>12.9 <i>MOSFET</i> Transistor with <i>CS</i> (Common Source) Configuration.</p> <p>12.10 <i>MOSFET</i> Transistor with <i>CG</i> (Common Gate) Configuration.</p> <p>12.11 <i>MOSFET</i> Transistor with <i>CD</i> (Common Drain) Configuration.</p> <p>12.12 Comparison of Bipolar and <i>MOSFET</i> Transistors in Various Configurations.</p> <p><b>13. IMPEDANCE MEASUREMENT.</b></p> <p>13.1 Introduction.</p> <p>13.2 Scale and Vector Voltage Measurement.</p> <p>13.3 Direct Impedance Measurement by Network Analyzer.</p> <p>13.4 Alternative Impedance Measurement by Network Analyzer.</p> <p>13.5 Impedance Measurement with the Assistance of a Circulator.</p> <p>Appendices.</p> <p>References.</p> <p><b>14. GROUNDING.</b></p> <p>14.1 Implications of Grounding.</p> <p>14.2 Possible Grounding Problems Hidden in a Schematic.</p> <p>14.3 Imperfect or Inappropriate Grounding Examples.</p> <p>14.4 “Zero” Capacitor.</p> <p>14.5 Quarter Wavelength of Micro Strip Line.</p> <p><b>15. EQUIPOTENTIALITY AND CURRENT COUPLING ON THE GROUND SURFACE.</b></p> <p>15.1 Equipotentiality on the Ground Surface.</p> <p>15.2 Forward and Return Current Coupling.</p> <p>15.3 <i>PCB</i> or <i>IC</i> Chip with Multi-metallic Layers.</p> <p><b>16. <i>RFIC</i> (RADIO FREQUENCY INTEGRATED CIRCUIT) AND <i>SOC </i> (SYSTEM ON CHIP).</b></p> <p>16.1 Interference and Isolation.</p> <p>16.2 Shielding for an <i>RF</i> Module by a Metallic Shielding Box.</p> <p>16.3 Strong Desirability to Develop <i>RFIC.</i></p> <p>16.4 Interference Going Along an <i>IC</i> Substrate Path.</p> <p>16.5 Solution for Interference Coming from the Sky.</p> <p>16.6 Common Grounding Rules for an <i>RF</i> Module and <i>RFIC</i> Design.</p> <p>16.7 Bottlenecks in <i>RFIC</i> Design.</p> <p>16.8 Prospect of <i>SOC</i>.</p> <p>16.9 What Is Next?</p> <p><b>17. MANUFACTURABILITY OF PRODUCT DESIGN.</b></p> <p>17.1 Introduction.</p> <p>17.2 Implication of 6<i>σ</i> Design.</p> <p>17.3 Approaching 6<i>σ</i> Design.</p> <p>17.4 Monte Carlo Analysis.</p> <p><b>PART III <i>RF</i> SYSTEM ANALYSIS.</b></p> <p><b>18. MAIN PARAMETERS AND SYSTEM ANALYSIS IN <i>RF</i> CIRCUIT DESIGN.</b></p> <p>18.1 Introduction.</p> <p>18.2 Power Gain.</p> <p>18.3 Noise.</p> <p>18.4 Non-Linearity.</p> <p>18.5 Other Parameters.</p> <p>18.6 Example of <i>RF</i> System Analysis.</p> <p>Appendices.</p> <p>References.</p> <p>INDEX.</p>

<p>Richard Chi-Hsi Li has designed RF/RFIC circuits at Motorola and other companies for more than twenty years. He has also taught a training course entitled "RF/RFIC Circuit Design." </p>

A Must-Read for all RF/RFIC Circuit Designers <p>This book targets the four most difficult skills facing RF/RFIC designers today: impedance matching, RF/AC grounding, Six Sigma design, and RFIC technology. Unlike most books on the market, it presents readers with practical engineering design examples to explore how they're used to solve ever more complex problems. The content is divided into three key parts:</p> <ul> <li> <p>Individual RF block circuit design</p> </li> <li> <p>Basic RF circuit design skills</p> </li> <li> <p>RF system engineering</p> </li> </ul> <p>The author assumes a fundamental background in RF circuit design theory, and the goal of the book is to enable readers to master the correct methodology. The book includes treatment of special circuit topologies and introduces some useful schemes for simulation and layout.</p> <p>This is a must-read for RF/RFIC circuit design engineers, system designers working with communication systems, and graduates and researchers in related fields.</p>

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