Details

Microwave and Millimetre-Wave Design for Wireless Communications

1. Aufl.

von: Ian Robertson, Nutapong Somjit, Mitchai Chongcheawchamnan
92,99 €
Verlag:	Wiley
Format:	PDF
Veröffentl.:	20.06.2016
ISBN/EAN:	9781118917299
Sprache:	englisch
Anzahl Seiten:	608

In den Warenkorb

Als Gutschein

DRM-geschütztes eBook, Sie benötigen z.B. Adobe Digital Editions und eine Adobe ID zum Lesen.

Beschreibungen

Titelbeschreibung

This book describes a full range of contemporary techniques for the design of transmitters and receivers for communications systems operating in the range from 1 through to 300 GHz. In this frequency range there is a wide range of technologies that need to be employed, with silicon ICs at the core but, compared with other electronics systems, a much greater use of more specialist devices and components for high performance – for example, high Q-factor/low loss and good power efficiency. Many text books do, of course, cover these topics but what makes this book timely is the rapid adoption of millimetre-waves (frequencies from 30 to 300 GHz) for a wide range of consumer applications such as wireless high definition TV, '5G' Gigabit mobile internet systems and automotive radars. It has taken many years to develop low-cost technologies for suitable transmitters and receivers, so previously these frequencies have been employed only in expensive military and space applications. The book will cover these modern technologies, with the follow topics covered; transmitters and receivers, lumped element filters, tranmission lines and S-parameters, RF MEMS, RFICs and MMICs, and many others. In addition, the book includes extensive line diagrams to illustrate circuit diagrams and block diagrams of systems, including diagrams and photographs showing how circuits are implemented practically. Furthermore, case studies are also included to explain the salient features of a range of important wireless communications systems. The book is accompanied with suitable design examples and exercises based on the Advanced Design System – the industry leading CAD tool for wireless design. More importantly, the authors have been working with Keysight Technologies on a learning & teaching initiative which is designed to promote access to industry-standard EDA tools such as ADS. Through its University Educational Support Program, Keysight offers students the opportunity to request a student license, backed up with extensive classroom materials and support resources. This culminates with students having the chance to demonstrate their RF/MW design and measurement expertise through the Keysight RF & Microwave Industry-Ready Student Certification Program. <a href="http://www.keysight.com/find/eesof-university" target="_blank">www.keysight.com/find/eesof-university</a> <a href="http://www.keysight.com/find/eesof-student-certification" target="_blank">www.keysight.com/find/eesof-student-certification</a>

Inhaltsverzeichnis

About the Authors xvii Acknowledgements xix Preface xxi 1 Introduction 1 1.1 A Brief Timeline of Consumer Electronics 2 1.2 The Electromagnetic Spectrum 3 1.3 Industry Trends 7 1.4 Forms of Wireless Communication 12 1.5 Conclusion 30 References 31 2 Transmitters and Receivers 32 2.1 Introduction 32 2.2 Transmitter and Receiver Components 33 2.3 Noise and Interference 38 2.4 Introduction to Modulation 48 2.5 Digital Modulation 50 2.6 Noise Analysis and Link Budget Calculation 61 2.7 Some Wireless Transceiver Architectures 71 2.8 Conclusion 79 References 80 3 Scattering Parameters 81 3.1 Introduction 81 3.2 Z-Parameters (Open-Circuit Impedance Parameters) 81 3.3 Y-Parameters (Short-Circuit Admittance Parameters) 82 3.4 H-Parameters (Hybrid Parameters) 83 3.5 ABCD-Parameters (Transmission or Chain Parameters) 84 3.6 Summary of Two-Port Parameter Operations 85 3.7 Scattering Parameters 87 3.8 Transmission Parameters 95 References 98 4 Lumped-Element Filters 99 4.1 Introduction 99 4.2 Filter Theory 100 4.3 Butterworth, Chebyshev and Elliptic Low-Pass Prototypes 107 4.4 Filter Design Method 111 4.5 Practical Lumped Elements 120 4.6 Capacitively-Coupled Resonator Filter 121 References 124 5 Transmission Line Theory 125 5.1 Introduction 125 5.2 Reflections on Transmission Lines 126 5.3 Transmission Line Theory 129 5.4 Standing Waves on a Lossless Transmission Line with Mismatched Load 135 5.5 The Smith Chart 142 5.6 The Signal Flow Graph 150 5.7 Conclusion 154 References 154 6 Transmission Line Components 155 6.1 Introduction 155 6.2 Coaxial Components 155 6.3 Twisted Pairs and Twin-Lead 157 6.4 Rectangular Waveguide 158 6.5 Microstrip 161 6.6 Common Microstrip Components 166 6.7 Uniplanar Transmission Lines 177 6.8 Other Transmission Line Types 179 6.9 Conclusion 184 References 185 7 Transmission Line Filters 187 7.1 Introduction 187 7.2 Unloaded Q of a Transmission Line Resonator 188 7.3 Lumped-to-Distributed Conversion 189 7.4 Impedance and Admittance Inverters 191 7.5 Richards Transformation 202 7.6 Unit Element, Kuroda’s Identity and Coupled-Lines Section 203 7.7 Stepped-Impedance Low-Pass Filter 208 7.8 Parallel-Coupled Line Filter 211 7.9 Interdigital Filter 217 7.10 Combline Filter 223 7.11 Hairpin Filter 233 7.12 Cross-Coupled Filters 237 7.13 Conclusion 246 References 247 8 Semiconductor Devices 248 8.1 Introduction 248 8.2 Fabrication Technology 249 8.3 Field-Effect Transistors 256 8.4 Bipolar Transistors 263 8.5 Package Styles 267 8.6 High-Power Transistors 269 8.7 RFICs and MMICs 271 8.8 Two-Terminal Devices 275 References 277 9 Impedance Matching 279 9.1 Introduction 279 9.2 The Purpose of Impedance Matching 279 9.3 Lumped-Element Matching Networks 282 9.4 Distributed Matching Networks 289 9.5 The Cyclic Nature of Distributed Circuits 295 9.6 Conclusion 296 References 296 10 Amplifiers 298 10.1 Introduction 298 10.2 Transistor Configurations 300 10.3 Classical Analysis of Gain and Stability 302 10.4 DC Biasing 309 10.5 Common Amplifier Topologies 310 10.6 Low-Noise Amplifiers 315 10.7 Nonlinearity and Intermodulation 318 10.8 Power Amplifier Classes of Operation 326 10.9 Power-Combining Techniques 334 10.10 Power Amplifier Linearisation 339 10.11 Conclusion 341 References 342 11 Oscillators 344 11.1 Introduction 344 11.2 Basic Concepts 344 11.3 Resonators 363 11.4 Some Oscillator Circuits 367 11.5 Oscillator Design Procedure 382 11.6 Conclusion 389 References 390 12 Mixers and Modulators 391 12.1 Introduction 391 12.2 Single-Ended Mixers 392 12.3 Balanced and Image-Rejection Mixers 398 12.4 Baluns and Couplers 402 12.5 Common Mixer Circuits 404 12.6 Modulators 409 12.7 Mixer Linearisation and Adaptive Signal Cancellation 412 12.8 Conclusion 412 References 413 13 RF MEMS 415 13.1 Introduction 415 13.2 Novel Transceiver Architectures using RF MEMS 416 13.3 Micromachined Transmission Lines and Passive Elements 416 13.4 RF MEMS Switches 420 13.5 Reconfigurable Impedance-Matching Networks 424 13.6 MEMS Phase Shifters 425 13.7 Tuneable Filters 426 13.8 MEMS Antennas 427 13.9 RF MEMS Fabrication and Packaging 428 13.10 Reliability and Design Consideration of RF MEMS Devices 430 References 432 14 Antennas and Propagation 434 14.1 Introduction 434 14.2 Antenna Systems 437 14.3 Transmission Equations, Free-Space Path Loss and Link Budget Calculation 447 14.4 Other Propagation Effects 451 14.5 Millimetre-Wave and THz Propagation 452 14.6 Indoor Propagation 453 14.7 Outdoor Propagation 455 14.8 Multipath Propagation 457 14.9 Antenna Arrays 458 14.10 Multiple-Input and Multiple-Output Systems 460 References 462 15 Digital Signal Processing for Transceivers 464 15.1 Introduction 464 15.2 RF Performance Challenges 464 15.3 DSP in Modern Wireless Communications Systems 467 15.4 Signal Conversion and Processing 468 15.5 Digital Calibration for I–Q Imbalance 482 15.6 Digital Predistortion Techniques 486 15.7 DSP Techniques for OFDM 489 15.8 MIMO 491 15.9 Conclusion 493 References 494 16 Packaging and Assembly 495 16.1 Introduction 495 16.2 Technology Options and System Partitioning 496 16.3 PCB/Laminate Technology 498 16.4 Thin-Film Fabrication 500 16.5 Thick-Film Fabrication 500 16.6 LTCC Technology 503 16.7 Chip Packaging 504 16.8 Manufacturing using Surface Mount Technology 508 16.9 System-in-Package and System-on-Substrate Technology 509 16.10 Transitions and Antenna-in-Package Techniques 512 16.11 Conclusion 512 References 513 17 Electronic Design Automation 515 17.1 Introduction 515 17.2 Linear Frequency-Domain Analysis 518 17.3 Time-Domain Simulation 518 17.4 Harmonic Balance 522 17.5 Large-Signal/Small-Signal Simulation 525 17.6 Planar Electromagnetic Simulation 529 17.7 3-D Electromagnetic Simulation 533 17.8 Integrated Circuit Simulation and Layout 534 17.9 Conclusion 538 References 538 18 Measurement Techniques 539 18.1 Introduction 539 18.2 The Oscilloscope 540 18.3 Function Generator and Arbitrary Waveform Generator 542 18.4 LCR Meters and Component Analysers 542 18.5 Signal Generators 542 18.6 Spectrum and Signal Analysers 544 18.7 Vector Network Analysers 547 18.8 Microstrip Test Fixture Measurements 558 18.9 Probe Station Measurements 560 18.10 Mixed-Mode S-Parameters 563 18.11 Source- and Load-Pull Measurements 565 18.12 X-Parameter Measurements 565 References 567 Glossary 569 Index 575

Autorenportrait

Professor Ian Robertson, University of Leeds, UK Ian Robertson (FIEEE 2012) received his BSc (Eng.) and PhD degrees from King's College London in 1984 and 1990, respectively. From 1984 to 1986 he worked in the MMIC Research Group at Plessey Research (Caswell). After that he returned to King's College London, initially as a Research Assistant and then as a Lecturer, leading the MMIC Research Team, and finally becoming Reader in 1994. In 1998 he was appointed Professor of Microwave Subsystems Engineering at the University of Surrey, where he established the Microwave Systems Research Group and was a founder member of the Advanced Technology Institute. In June 2004 he was appointed to the University of Leeds Centenary Chair in Microwave and Millimetre-Wave Circuits and he is now Head of the School of Electronic & Electrical Engineering. Dr Nutapong Somjit, University of Leeds, UK Nutapong Somjit?received the Dipl.-Ing. (M.Sc.) from Dresden University of Technology, Dresden, Germany, in 2005, and the PhD from KTH Royal Institute of Technology, Stockholm, Sweden, in 2012, all in electrical engineering. Since August 2012, he has been with the Chair for Circuit Design and Network Theory, Dresden University of Technology, where he leads a research team in microsensors and MEMS ICs. He is currently a lecturer (assistant professor) in the School of Electronic and Electrical Engineering, University of Leeds, United Kingdom. Dr Mitchai Chongcheawchamnan, Prince of Songkla University, Thailand Mitchai Chongcheawchamnan was born in Bangkok, Thailand. He received the B.Eng. degree in telecommunication from King Mongkut's Institute of Technology Ladkrabang, Bangkok, in 1992, the M.Sc. degree in communication and signal processing from Imperial College, London, U.K., in 1995, and the Ph.D. degree in electrical engineering from the University of Surrey, Guildford, U.K., in 2001. He joined the Mahanakorn University of Technology, Bangkok, in 1992, as a Lecturer. In 2008, he joined the Faculty of Engineering, Prince of Songkla University, Songkhla, Thailand, as an Associate Professor.