Details

<p>About the Editors xiii</p> <p>List of Contributors xv</p> <p>Preface xvii</p> <p><b>1 What Is an Electrical Connector? </b><b>1<br /></b><i>Michael G. Pecht and San Kyeong</i></p> <p>1.1 Challenges of Separable Connectors 1</p> <p>1.2 Components of a Connector 2</p> <p>1.2.1 Contact Springs 2</p> <p>1.2.2 Contact Finishes 3</p> <p>1.2.2.1 Noble Metal Contact Finishes 4</p> <p>1.2.2.2 Non-noble Metal Contact Finishes 4</p> <p>1.2.3 Connector Housing 4</p> <p>1.2.4 Contact Interface 5</p> <p>1.3 Connector Types 6</p> <p>1.3.1 Board-to-Board Connectors 7</p> <p>1.3.2 Wire/Cable-to-Wire/Cable Connectors 8</p> <p>1.3.3 Wire/Cable-to-Board Connectors 10</p> <p>1.4 Connector Terminology 11</p> <p>References 14</p> <p><b>2 Connector Housing </b><b>17<br /></b><i>Michael G. Pecht</i></p> <p>2.1 Mechanical Properties 17</p> <p>2.2 Electrical Properties 19</p> <p>2.3 Flammability 21</p> <p>2.4 Temperature Rating 22</p> <p>2.5 Housing Materials 23</p> <p>2.5.1 Thermoplastic Polymers 25</p> <p>2.5.1.1 Polyesters 25</p> <p>2.5.1.2 Polyimides, Polyamide-imides, and Polyetherimides 26</p> <p>2.5.1.3 Polyphenylene Sulfides 26</p> <p>2.5.1.4 Polyether Ether Ketones 26</p> <p>2.5.1.5 Liquid-Crystalline Polymers 27</p> <p>2.5.1.6 Comparison ofThermoplastic Polymers 27</p> <p>2.5.2 Thermosetting Polymers 27</p> <p>2.5.3 Additives to Housing Materials 29</p> <p>2.5.4 Manufacturing of Housing Materials 29</p> <p>References 30</p> <p><b>3 Contact Spring </b><b>31<br /></b><i>Michael G. Pecht</i></p> <p>3.1 Copper Alloys 31</p> <p>3.1.1 Unified Number System (UNS) 31</p> <p>3.1.2 Properties of Copper Alloys 33</p> <p>3.2 Nickel Alloys 37</p> <p>3.3 Conductive Elastomers 37</p> <p>3.4 Contact Manufacturing 38</p> <p>References 41</p> <p><b>4 Contact Plating </b><b>43<br /></b><i>Michael G. Pecht</i></p> <p>4.1 Noble Metal Plating 43</p> <p>4.1.1 Gold 44</p> <p>4.1.2 Palladium 46</p> <p>4.1.3 Combination of Gold and Palladium 47</p> <p>4.2 Non-noble Metal Plating 47</p> <p>4.2.1 Silver 48</p> <p>4.2.1.1 Characteristics of Silver as a Contact Finish 49</p> <p>4.2.1.2 Potential Tarnish-Accelerating Factors 50</p> <p>4.2.1.3 Use of Silver in Typical Connectors 53</p> <p>4.2.1.4 Managing Silver Corrosion 54</p> <p>4.2.2 Silver-Palladium Alloys 55</p> <p>4.2.3 Nanocrystalline Silver Alloys 55</p> <p>4.2.4 Silver-Bismuth Alloys 57</p> <p>4.2.5 Tin 57</p> <p>4.2.6 Nickel Contact Finishes 59</p> <p>4.3 Underplating 59</p> <p>4.4 Plating Process 60</p> <p>4.4.1 Electrolytic Plating 61</p> <p>4.4.1.1 Rack Plating 61</p> <p>4.4.1.2 Barrel Plating 61</p> <p>4.4.2 Electroless Plating 62</p> <p>4.4.3 Cladding 63</p> <p>4.4.4 Hot Dipping 63</p> <p>References 63</p> <p><b>5 Insertion and Extraction Forces </b><b>67<br /></b><i>Michael G. Pecht</i></p> <p>5.1 Insertion and Extraction Forces 67</p> <p>5.2 Contact Retention 70</p> <p>5.3 Contact Force and Deflection 70</p> <p>5.4 Contact Wipe 71</p> <p>References 73</p> <p><b>6 Contact Interface </b><b>75<br /></b><i>Michael G. Pecht and San Kyeong</i></p> <p>6.1 Constriction Resistance 76</p> <p>6.2 Contact Resistance 77</p> <p>6.3 Other Factors Affecting Contact Resistance 79</p> <p>6.4 Current Rating 81</p> <p>6.5 Capacitance and Inductance 82</p> <p>6.6 Bandpass and Bandwidth 86</p> <p>References 87</p> <p><b>7 The Back-End Connection </b><b>89<br /></b><i>Chien-Ming Huang, San Kyeong and Michael G. Pecht</i></p> <p>7.1 Soldered Connection 89</p> <p>7.2 Press-Fit Connection 93</p> <p>7.3 Crimping Connection 95</p> <p>7.4 Insulation Displacement Connection 98</p> <p>References 98</p> <p><b>8 Loads and Failure Mechanisms </b><b>103<br /></b><i>San Kyeong, Lovlesh Kaushik and Michael G. Pecht</i></p> <p>8.1 Environmental Loads 104</p> <p>8.1.1 Temperature 104</p> <p>8.1.2 Vibration Load 105</p> <p>8.1.3 Humidity 106</p> <p>8.1.4 Contamination 107</p> <p>8.1.5 Differential Pressure 108</p> <p>8.2 Failure Mechanisms in Electrical Connectors 109</p> <p>8.2.1 Silver Migration 110</p> <p>8.2.2 Tin Whiskers 114</p> <p>8.2.3 Corrosion Failure 119</p> <p>8.2.3.1 Dry Corrosion 119</p> <p>8.2.3.2 Galvanic Corrosion 120</p> <p>8.2.3.3 Pore Corrosion 121</p> <p>8.2.3.4 Creep Corrosion 121</p> <p>8.2.3.5 Fretting Corrosion 123</p> <p>8.2.4 Arc Formation 124</p> <p>8.2.5 Creep Failure 128</p> <p>8.2.6 Wear 131</p> <p>8.2.6.1 Adhesive Wear 132</p> <p>8.2.6.2 Abrasive Wear 133</p> <p>8.2.6.3 Fatigue Wear 134</p> <p>8.2.6.4 Corrosive Wear 134</p> <p>8.2.6.5 Fretting Wear 135</p> <p>8.2.7 Frictional Polymerization 136</p> <p>8.3 Case Study by NASA: Electrical Connectors for Spacecraft 137</p> <p>References 139</p> <p><b>9 Fretting in Connectors </b><b>147<br /></b><i>Deepak Bondre and Michael G. Pecht</i></p> <p>9.1 Mechanisms of Fretting Failure 149</p> <p>9.1.1 Material Factors That Affect Fretting 152</p> <p>9.1.1.1 Contact Materials 152</p> <p>9.1.1.2 Hardness 155</p> <p>9.1.1.3 Surface Finish 155</p> <p>9.1.1.4 Frictional Polymerization 156</p> <p>9.1.1.5 Grain Size 156</p> <p>9.1.1.6 Oxides 157</p> <p>9.1.1.7 Coefficient of Friction 158</p> <p>9.1.1.8 Electrochemical Factor 158</p> <p>9.1.2 Operating Factors That Affect Fretting 158</p> <p>9.1.2.1 Contact Load 158</p> <p>9.1.2.2 Fretting Frequency 159</p> <p>9.1.2.3 Slip Amplitude 162</p> <p>9.1.2.4 Electric Current 162</p> <p>9.1.3 Environmental Factors That Affect Fretting 163</p> <p>9.1.3.1 Humidity 164</p> <p>9.1.3.2 Temperature 164</p> <p>9.1.3.3 Dust 165</p> <p>9.2 Reducing the Damage of Fretting 167</p> <p>9.2.1 Lubrication 168</p> <p>9.2.2 Improvement in Design 168</p> <p>9.2.3 Coatings 169</p> <p>References 170</p> <p><b>10 Testing </b><b>173<br /></b><i>Bhanu Sood andMichael G. Pecht</i></p> <p>10.1 Dielectric With standing Voltage Testing 173</p> <p>10.2 Insulation Resistance Testing 174</p> <p>10.3 Contact Resistance Testing 176</p> <p>10.4 Current Rating 179</p> <p>10.5 Electromagnetic Interference and Electromagnetic Compatibility Testing 180</p> <p>10.6 Temperature Life Testing 181</p> <p>10.7 Thermal Cycling Testing 182</p> <p>10.8 Thermal Shock Testing 182</p> <p>10.9 Steady-State Humidity Testing 183</p> <p>10.10 Temperature Cycling with Humidity Testing 184</p> <p>10.11 Corrosion 184</p> <p>10.11.1 Dry Corrosion 185</p> <p>10.11.2 Creep Corrosion 186</p> <p>10.11.3 Moist Corrosion 187</p> <p>10.11.4 Fretting Corrosion 187</p> <p>10.12 Mixed Flowing Gas Testing 188</p> <p>10.12.1 Battelle Labs MFG Test Methods 189</p> <p>10.12.2 EIA MFG Test Methods: EIA 364-TP65A 190</p> <p>10.12.3 IEC MFG Test Methods: IEC 68-2-60 Part 2 190</p> <p>10.12.4 Telcordia MFG Test Methods: Telcordia GR-63-CORE Section 5.5 191</p> <p>10.12.5 IBM MFG Test Methods: G1(T) 191</p> <p>10.12.6 CALCE MFG Chamber Capability 192</p> <p>10.13 Vibration 192</p> <p>10.13.1 Mechanical Shock 193</p> <p>10.13.2 Mating Durability 193</p> <p>10.14 Highly Accelerated Life Testing 194</p> <p>10.15 Environmental Stress Screening 194</p> <p>References 195</p> <p><b>11 Supplier Selection </b><b>197<br /></b><i>Michael H. Azarian, Diganta Das and Michael G. Pecht</i></p> <p>11.1 Connector Reliability 197</p> <p>11.2 Capability Maturity Models 198</p> <p>11.3 Key Reliability Practices 198</p> <p>11.3.1 Reliability Requirements and Planning 199</p> <p>11.3.2 Training and Development 200</p> <p>11.3.3 Reliability Analysis 200</p> <p>11.3.4 Reliability Testing 201</p> <p>11.3.5 Supply-Chain Management 201</p> <p>11.3.6 Failure Data Tracking and Analysis 202</p> <p>11.3.7 Verification and Validation 202</p> <p>11.3.8 Reliability Improvement 203</p> <p>11.4 Reliability Capability of an Organization 203</p> <p>11.5 The Evaluation Process 204</p> <p>References 205</p> <p><b>12 Selecting the Right Connector </b><b>207<br /></b><i>Ilknur Baylakoglu and San Kyeong</i></p> <p>12.1 Connector Requirements Based on Design and Targeted Application 207</p> <p>12.2 Mating Cycles 208</p> <p>12.3 Current and Power Ratings 209</p> <p>12.4 Environmental Conditions 212</p> <p>12.5 Termination Types 213</p> <p>12.6 Materials 213</p> <p>12.6.1 Connector Housing Materials 216</p> <p>12.6.2 Connector Spring Materials 217</p> <p>12.7 Contact Finishes 217</p> <p>12.8 Reliability 218</p> <p>12.9 Raw Cables and Assemblies 219</p> <p>12.10 Supplier Reliability Capability Maturity 219</p> <p>12.11 Connector Selection Team 220</p> <p>12.12 Selection of Candidate Parts from a Preferred Parts Database 221</p> <p>12.13 Electronic Product Manufacturers’ Parts Databases 221</p> <p>12.14 Parts Procurement 223</p> <p>12.15 Parts Availability 223</p> <p>12.16 High-Speed Connector Selection 224</p> <p>12.17 NASA Connector Selection 224</p> <p>12.18 Harsh Environment Connector Selection 227</p> <p>12.19 Fiber-Optic Interconnect Requirements by Market 229</p> <p>12.20 High-Power Subsea Connector Selection 229</p> <p>12.20.1 Undersea Connector Reliability 231</p> <p>12.21 Screening Tests 232</p> <p>12.22 Low-Voltage Automotive Single- and Multiple-Pole Connector Validation 236</p> <p>12.23 Failure Modes, Mechanisms, and Effects Analysis for Connectors 236</p> <p>12.24 Connector Experiments 242</p> <p>12.25 Summary 246</p> <p>References 246</p> <p><b>13 Signal Connector Selection </b><b>251<br /></b><i>Michael G. Pecht</i></p> <p>13.1 Issues Involving High-Speed Connectors 251</p> <p>13.2 Signal Transmission Quality Considerations 252</p> <p>13.2.1 Interconnect Delays 252</p> <p>13.2.2 Signal Distortion 252</p> <p>13.3 Electromagnetic Compatibility 253</p> <p>13.4 Virtual Prototyping 254</p> <p>13.4.1 TDR Impedance Measurements 255</p> <p>13.4.1.1 Reflection Coefficient 255</p> <p>13.4.1.2 TDR Resolution Factors 256</p> <p>13.4.1.3 TDR Accuracy Factors 257</p> <p>13.5 Vector Network Analyzer 259</p> <p>13.6 Simulation Program with Integrated Circuit Emphasis (SPICE) 259</p> <p>References 260</p> <p><b>14 Advanced Technology Attachment Connectors </b><b>261<br /></b><i>Neda Shafiei, Kyle LoGiudice and Michael G. Pecht</i></p> <p>14.1 ATA Connector and SATA Connector Overview 261</p> <p>14.2 History of ATA and SATA 263</p> <p>14.3 Physical Description of ATA Connectors, ATA Alternative Connectors, and SATA Connectors 264</p> <p>14.4 ATA Standardization and Revisions 268</p> <p>14.5 SATA Standardization and Revisions 270</p> <p>14.6 SATA in the Future 272</p> <p>References 273</p> <p><b>15 Power Connectors </b><b>275<br /></b><i>Michael G. Pecht and San Kyeong</i></p> <p>15.1 Requirements for Power Connectors 275</p> <p>15.2 Power Connector Materials 276</p> <p>15.3 Types of Power Connectors 277</p> <p>15.4 Power Contact Resistance 280</p> <p>15.5 Continuous, Transient, and Overload Current Capacities 282</p> <p>15.5.1 Continuous Current Capacity 282</p> <p>15.5.2 Transient Current Capacity 283</p> <p>15.5.3 Overload Current Capacity 284</p> <p>15.6 Current Rating Method 284</p> <p>References 286</p> <p><b>16 Electrical Connectors for Underwater Applications </b><b>289<br /></b><i>Flore Remouit, Jens Engström and Pablo Ruiz-Minguela</i></p> <p>16.1 Background and Terminology 290</p> <p>16.1.1 History 291</p> <p>16.1.2 Terminology 291</p> <p>16.2 Commercial Off-the-Shelf (COTS) Connectors 292</p> <p>16.2.1 Rubber-Molded 292</p> <p>16.2.2 Rigid-Shell or Bulkhead Assemblies 293</p> <p>16.2.3 Fluid-Filled UnderwaterMateable 294</p> <p>16.2.4 Inductive Coupling 295</p> <p>16.2.5 Assemblies (Non-unmateable) 295</p> <p>16.3 Connector Design 296</p> <p>16.3.1 Thermal Design 296</p> <p>16.3.2 Electrical Properties 297</p> <p>16.3.3 Mechanical Properties 299</p> <p>16.3.4 Material Choices 300</p> <p>16.3.5 Specifications for Underwater Connectors 301</p> <p>16.4 Connector Deployment and Operation 302</p> <p>16.4.1 Connection Procedure 302</p> <p>16.4.2 Connection Layout 303</p> <p>16.4.3 Reliability 305</p> <p>16.5 Discussion and Conclusion 305</p> <p>References 306</p> <p><b>17 Examples of Connectors </b><b>313<br /></b><i>Lei Su, Xiaonan Yu, San Kyeong andMichael G. Pecht</i></p> <p>17.1 Amphenol ICC M-Series^TM 56 Connectors 313</p> <p>17.2 Amphenol ICC Paladin^®Connectors 313</p> <p>17.3 Amphenol ICC 3000W EnergyEdge^TM X-treme Card Edge Series 314</p> <p>17.4 Amphenol ICC FLTStack Connectors 314</p> <p>17.5 Amphenol ICC HSBridge Connector System 315</p> <p>17.6 Amphenol ICC MUSBR Series USB 3.0 Type-A Connectors 315</p> <p>17.7 Amphenol ICCWaterproof USB Type-C^TM Connectors 316</p> <p>17.8 Amphenol ICC NETBridge^TM Connectors 316</p> <p>17.9 Amphenol Sine Systems DuraMate^TM AHDP Circular Connectors 317</p> <p>17.10 Amphenol Aerospace MIL-DTL-38999 Series III Connectors 318</p> <p>17.11 Fischer Connectors UltiMate^TM Series Connectors 318</p> <p>17.12 Hirose Electric DF50 Series Connectors 319</p> <p>17.13 Hirose Electric microSD^TM Card Connectors 320</p> <p>17.14 Molex SAS-3 and U.2 (SFF-8639) Backplane Connectors 320</p> <p>17.15 Molex NeoPress^TM Mezzanine Connectors 321</p> <p>17.16 Molex Impel^TM Plus Backplane Connectors 321</p> <p>17.17 Molex EXTreme Guardian^TM Power Connectors 322</p> <p>17.18 Molex Imperium^TM High Voltage/High Current Connectors 323</p> <p>17.19 TE Connectivity Free Height Connectors 323</p> <p>17.20 TE Connectivity STRADAWhisper Connectors 323</p> <p>17.21 TE ConnectivityMULTI-BEAM High-Density (HD) Connectors 324</p> <p>17.22 TE Connectivity HDMI^TM Connectors 325</p> <p>17.23 TE Connectivity AMP CT Connector Series 325</p> <p>17.24 TE ConnectivityMicro Motor Connectors 326</p> <p>17.25 TE Connectivity AMPSEAL Connectors 326</p> <p>17.26 TE Connectivity M12 X-Code Connectors 327</p> <p>17.27 TE Connectivity SOLARLOK 2.0 Connectors 327</p> <p>17.28 TE Connectivity Busbar Connectors 328</p> <p>References 329</p> <p><b>Appendix</b></p> <p>Standards 331</p> <p>A.1 Standard References for Quality Management and Assurance 332</p> <p>A.2 General Specifications for Connectors 332</p> <p>A.3 Safety-Related Standards and Specifications 332</p> <p>A.4 Standard References for Connector Manufacturing 333</p> <p>A.5 Standard References for Socket Material Property Characterization 334</p> <p>A.6 Standard References for Socket Performance Qualification 335</p> <p>A.7 Standard References for Socket Reliability Qualification 336</p> <p>A.8 Other Standards and Specifications 338</p> <p>A.9 Telcordia 338</p> <p>A.10 Society of Cable Telecommunications Engineers (SCTE) 339</p> <p>A.11 Electronic Industries Alliance/Telecommunications Industry Association (EIA/TIA) 339</p> <p>A.12 International Electrotechnical Commission (IEC) 340</p> <p>A.12.1 IEC Standards 341</p> <p>A.12.2 IEC Connectors 341</p> <p>A.13 Military Standards (MIL-STD) 341</p> <p>A.14 Standards for Space-Grade Connectors 342</p> <p>References 345</p> <p>Index 347</p>

<p><b>SAN KYEONG</b> is a staff engineer at the R&D headquarters of Samsung Electro-Mechanics Company, currently working as a Research Scientist with the Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, USA. He received a BE degree and PhD in chemical and biological engineering from the Seoul National University of Seoul, South Korea, in 2010 and 2016, respectively. He has expertise in material engineering for passive electronic components. <p><b>MICHAEL G. PECHT, P<small>H</small>D,</b> is Chair Professor and Director of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, USA. He received his PhD in Engineering Mechanics from the University of Wisconsin at Madison, USA. He is an IEEE, ASME, SAE, and IMAPS Fellow.

<p><b>Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resource</b> <p><i>Electrical Connectors: Design, Manufacture, Test, and Selection</i> delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and author Michael G. Pecht offers readers a thorough explanation of the key performance and reliability concerns and trade-offs involved in electrical connector selection. <p>Readers, both at introductory and advanced levels, will discover the latest industry standards for performance, reliability, and safety assurance. The book discusses everything a student or practicing engineer might require to design, manufacture, or select a connector for any targeted application. The science of contact physics, contact finishes, housing materials, and the full connector assembly process are all discussed at length, as are test methods, performance, and guidelines for various applications. <p><i>Electrical Connectors</i> covers a wide variety of other relevant and current topics, like: <ul> <li>A comprehensive description of all electrical connectors, including their materials, components, applications, and classifications</li> <li>A discussion of the design and manufacture of all parts of a connector</li> <li>Application-specific criteria for contact resistance, signal quality, and temperature rise</li> <li>An examination of key suppliers, materials used, and the different types of data provided</li> <li>A presentation of guidelines for end-users involved in connector selection and design</li> </ul> <p>Perfect for connector manufacturers who select, design, and assemble connectors for their products or the end users who concern themselves with operational reliability of the system in which they're installed, <i>Electrical Connectors</i> also belongs on the bookshelves of students learning the basics of electrical contacts and those who seek a general reference with best-practice advice on how to choose and test connectors for targeted applications.

GB